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SimpleLink™ Sub-1 GHz CC1312R Wireless Microcontroller (MCU) LaunchPad™ Development Kit NEW
The SimpleLink™ Sub-1 GHz CC1312R wireless microcontroller (MCU) LaunchPad™ development kit with Sub-1GHz Rado, which offers long-range connectivity, combined with a 32-bit ARM® Cortex®-M4F processor on a single chip
SimpleLink™ Multi-Band CC1352R Wireless MCU LaunchPad™ Development Kit
The CC1352 device is part of the SimpleLink™ microcontroller (MCU) platform which consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz and host MCUs, which all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set.
SimpleLink™ MSP432P401R LaunchPad™ Development Kit for High Performance Applications
The SimpleLink™ MSP432P401R LaunchPad™ development kit enables you to develop high-performance applications that benefit from low-power operation. It features the MSP432P401R – which includes a 48MHz ARM® Cortex®-M4F, 80uA/MHz active power and 660nA RTC operation, SAR Precision ADC with 16-bit performance and AES256 accelerator.
SimpleLink™2MB Flash MSP432P4111 MCU LaunchPad™ Development Kit
To kick start your development, we offer two LaunchPads with optimized external RF components, one for Sub-1GHz PA and another for 2.4GHz PA wireless operations:
Smart Analog Combo MCU LaunchPad™ Development Kit
The MSP-EXP430FR2355 LaunchPad™ Development Kit is an easy-to-use evaluation module based on the MSP430FR2355 Value Line MCU. The MCU includes a smart analog combo of configurable signal chain elements including options for multiple 12-bit DACs and PGAs along with a 12-bitADC and two eCOMPs.
MSP430F5529 USB LaunchPad Evaluation Kit
The MSP430FR2355 MCU includes a smart analog combo of configurable signal chain elements including options for multiple 12-bit digital-to-analog converters (DACs) and programmable gain amplifiers (PGAs) along with a 12-bit analog-to-digital converter (ADC) and two enhanced comparators (eCOMPs).
SOIC Package–Universal Do-It-Yourself (DIY) Amplifier Circuit Evaluation Module
The SOIC package DIYAMP-EVM provides engineers and DIYers with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages and 12 popular amplifier configurations for single and dual supply.
PGA460-Q1 Ultrasonic Sensor Signal Conditioning EVM With Transducers
This evaluation module (EVM) allows users to evaluate the functionality of the PGA460-Q1 ultrasonic sensor-signal conditioner IC, which is a fully integrated system-on-chip, analog front-end (AFE) device for ultrasonic sensing. Another objective of this EVM is to display the ultrasonic echo profile and measurement results of either a transformer driven closed-top transducer or direct-driven open-top transducer when using the GUI.
DRV8323RS Three-Phase Smart Gate Driver Evaluation Module
The BOOSTXL-DRV8323RS is a 15A, 3-phase brushless DC drive stage based on the DRV8323RH gate driver and CSD88599Q5DC NexFETTM power blocks. It has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making it ideal for sensorless BLDC algorithms. The drive stage is fully protected and easily configurable via the devices SPI registers.